BE Semiconductor Industries Investor Relations Material

BE Semiconductor Industries N.V. (Besi) specializes in the development and manufacturing of semiconductor assembly equipment. The company's products are used in the assembly of semiconductor chips for a variety of applications, including mobile devices, computing, automotive, and industrial electronics. They have clients in the semiconductor manufacturing industry, providing equipment that supports the production of high-performance and miniaturized electronic components. The company is headquartered in Duiven, the Netherlands, and its shares are listed on the Euronext Amsterdam.

Besi’s clientele includes some of the largest semiconductor manufacturers in the world, who rely on the company’s equipment to produce cutting-edge chips that power a vast array of electronic products. The company’s portfolio of products is focused on advanced semiconductor packaging, offering solutions that are critical for the miniaturization and enhanced performance of electronic components. The company’s core product lines include die attach systems, packaging systems, and plating systems.

• Die Attach Systems: These are crucial in the initial stages of semiconductor assembly, where the semiconductor die is attached to the substrate or package. Besi’s die attach equipment supports high precision and high-speed processes, which are vital for the production of advanced packages, such as those used in smartphones and other high-performance devices.

• Packaging Systems: Besi provides a range of packaging solutions designed to meet the demands of increasingly complex and miniaturized semiconductor packages. The company’s packaging systems are used for various technologies including wafer-level packaging, flip-chip, and fan-out packaging. These systems enable the production of chips that offer greater functionality while occupying less space, which is essential for modern electronic devices.

• Plating Systems: Besi’s plating systems are used to deposit metal layers on semiconductor wafers, a process essential for creating electrical connections in semiconductor devices. The company’s equipment supports advanced plating techniques required for fine-pitch interconnections, which are critical for high-density electronic components.