BE Semiconductor Industries (BESI) investor relations material

Company overview and strategy

• Focus on advanced packaging and rapid growth segments has established industry leadership, with significant expansion in Asia and successful acquisitions enhancing efficiency and scalability.

• Strategic objectives include technology leadership, expanding wafer-level assembly, acquisitions, market presence, sustainability, and cost reduction.

• 2025 strategic highlights feature increased revenue targets (€1.5–€1.9B), hybrid bonding adoption, new product launches, and progress toward sustainability goals.

• Capital allocation has delivered superior total returns (155% over 3 years, 2,076% over 10 years), with €2.4B returned to shareholders since 2011.

Market positioning and trends

• Advanced packaging is a key growth driver, with AI-related semiconductors expected to grow at a 16.5% CAGR from 2025–2035.

• Significant investments (~$100B) in new advanced packaging fabs globally, especially in Asia and the US.

• Assembly equipment market projected to grow 74% from 2025–2030, with advanced packaging outpacing traditional segments.

• Hybrid bonding and advanced TCB markets are expected to reach €1.65B by 2030, with hybrid bonding becoming the largest assembly segment.

Product portfolio and innovation

• Die attach equipment accounts for 80% of 2025 revenue, with packaging and plating making up the rest.

• R&D investment has more than doubled since 2020, focusing on next-gen advanced packaging, hybrid bonding, and high-accuracy systems.

• Hybrid bonding roadmap targets 25nm alignment accuracy and >5,000 units per hour, with over 150 systems installed.

• TC Next complements hybrid bonding, offering high-throughput, ultra-fine pitch chiplet packaging for AI and logic applications.