All Ring Tech (6187) Q3 2024 earnings summary

Executive summary

• Nine-month revenue was NT$3,937,076 thousand and net income was NT$894,718 thousand, versus NT$835,312 thousand and NT$73,167 thousand, respectively, in 2023.

• Cash and cash equivalents reached NT$3,732,259 thousand at September 30, 2024, versus NT$1,109,992 thousand a year earlier.

• Automation equipment supplier serving semiconductor test and packaging and passive-component manufacturing; established in 1996 with NT$966 million capital.

• R&D represented 60% of staff; hardware and software accounted for 49% and 51% of R&D resources, respectively.

Financial highlights

• Q3 revenue was NT$1,942,400 thousand versus NT$331,647 thousand YoY; nine-month revenue was NT$3,937,076 thousand versus NT$835,312 thousand.

• Q3 operating profit was NT$471,772 thousand versus NT$9,271 thousand; nine-month operating profit was NT$919,151 thousand versus NT$12,026 thousand.

• Q3 net income was NT$452,234 thousand versus NT$28,763 thousand; nine-month net income was NT$894,718 thousand versus NT$73,167 thousand.

• Q3 basic/diluted EPS was NT$5.32/NT$5.10 versus NT$0.35/NT$0.34; nine-month EPS was NT$10.30/NT$10.17 versus NT$0.90/NT$0.90.

• Nine-month operating cash flow was NT$943,738 thousand versus NT$237,222 thousand; investing cash use was NT$16,902 thousand versus NT$282,609 thousand.

Segment performance

• Nine-month external revenue from the primary operating segment was NT$3,783,760 thousand, versus NT$727,592 thousand in 2023; another reportable operation contributed NT$141,858 thousand versus NT$95,366 thousand.

• Additional segment external revenue was NT$11,458 thousand versus NT$12,354 thousand; consolidated external revenue totaled NT$3,937,076 thousand versus NT$835,312 thousand.

• Semiconductor represented 92% of 2024.3Q revenue, compared with 77% in 2023 and 78% in 2022; passive components represented 4%, versus 9% and 17%, while other was 4%, versus 14% and 5%.

• Revenue primarily came from automation machinery and equipment, with sales recognized when goods transfer to customers.

• Semiconductor equipment covers flip-chip packaging processes; passive-component automation spans production steps from ball milling through testing, plating, and taping.