Investor presentation
Logotype for eMemory Technology Inc

eMemory Technology (3529) Investor presentation summary

Event summary combining transcript, slides, and related documents.

Logotype for eMemory Technology Inc

Investor presentation summary

19 Aug, 2026

Market leadership and business overview

  • Leads global market in logic NVM and PUF-based security IPs, with over 79M cumulative wafers shipped and 1,370+ patents issued.

  • Recognized as TSMC's Best IP Partner for 16 consecutive years, with a strong R&D focus and expanding IP footprint.

  • Over 850 registered IPs and 2,600+ new tape-outs at TSMC, supporting broad customer adoption across advanced and mature nodes.

  • More than 25M wafer shipments at TSMC, generating recurring royalty revenue and long-term business visibility.

  • Secured over 150 advanced-node tape-out licenses, building a high-value royalty pipeline.

Technology portfolio and innovation

  • IP portfolio built on OTP as the foundation and MTP for scalable integration, with pioneering PUF-based security IPs.

  • Offers a range of technologies: NeoBit, NeoFuse (OTP), NeoFlash, NeoMTP, NeoEE (MTP), Embedded ReRAM, and NeoPUF (PUF).

  • NeoPUF leverages unique microscopic variations for on-demand key generation, providing a hardware root of trust.

  • Advanced security solutions include anti-fuse OTP, multi-time programmable memory, and post-quantum cryptography (PQC) support.

  • Hardware root of trust secures the entire software stack, ensuring immutable and foundational security.

Competitive advantages and efficiency

  • Embedded NVM IP enables faster, more efficient, and space-saving integration compared to external memory.

  • OTP outperforms e-fuse in area efficiency, reducing area by over 80% and eliminating the need for buffer SRAM.

  • NeoFuse OTP enables high-density SRAM repair, addressing scaling challenges at advanced nodes with compact size.

  • Seamless process integration with zero-mask overhead and optimized write/erase cycles for extended operational lifespan.

  • Collaboration with Siemens Tessent enhances memory repair and redundancy analysis for robust defect management.

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