RedChip Future Tech Investor Conference
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Everspin Technologies (MRAM) RedChip Future Tech Investor Conference summary

Event summary combining transcript, slides, and related documents.

Logotype for Everspin Technologies Inc

RedChip Future Tech Investor Conference summary

10 Jun, 2026

Company overview and technology

  • Leading provider of MRAM, a magnetic tunnel junction-based memory, serving mission-critical applications in data center, industrial, IoT, automotive, and radiation-hardened sectors.

  • MRAM is radiation immune, fast, persistent, and does not require a battery to retain data.

  • Over 200 million units shipped to 2,000+ customers globally, with a strong patent portfolio of 700+ patents.

  • Operates an 8-inch MRAM manufacturing line in the U.S. and leverages GLOBALFOUNDRIES and soon TSMC for 12-inch production.

  • Only domestic MRAM provider for U.S. mission-critical applications, supporting government and commercial programs.

Product portfolio and roadmap

  • Product lines include PERSYST (in production), UNISYST (sampling end of year, production early next year), and AgILYST (under development for AI/data center, 2-3 years out).

  • Recent launches include xSPI family (EMxxLX) for higher density and faster performance.

  • Upcoming UNISYST product at TSMC will replace NOR flash, offering much higher speed and endurance.

  • Roadmap targets densities from 256 Mb to multi-gigabit, with plans to address AI and data center markets.

  • Revenue goal to double from $50M to $100M by 2029, driven by new products and licensing.

Market opportunity and financials

  • Total addressable market (TAM) expected to grow from $1B to $4.3B by 2029, mainly by entering the NOR flash replacement market.

  • Strong financial position with zero debt and positive free cash flow for the past 4-5 years.

  • Licensing revenue targeted at 10%-15% of total, with major focus on product revenue.

  • Licensing partners include Alps, Bosch, Seagate, Toshiba, and GLOBALFOUNDRIES.

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