KLA (KLAC) Citi’s 2026 Global TMT Conference summary
Event summary combining transcript, slides, and related documents.
Citi’s 2026 Global TMT Conference summary
9 Sep, 2026Market outlook and growth trends
Wafer Fab Equipment (WFE) expectations for 2024 have increased to over $150 billion, with momentum building into the second half of the year and strong growth anticipated through 2027 and into early 2028.
Backlog has grown 60% year-over-year to $12.6 billion, with most orders covering 12–18 month delivery windows, reflecting high customer engagement and strong visibility into future shipments.
Supply chain constraints, especially in optical components, are easing, with new capacity coming online and long-term planning extending to 2029–2030.
Foundry logic and advanced nodes (2 nm, 3 nm) are driving higher process control intensity, benefiting from increased design complexity and more players investing at the leading edge.
High-Bandwidth Memory (HBM) and advanced logic are creating new opportunities, with process control intensity in HBM approaching that of advanced logic.
Advanced packaging and technology adoption
Share in the advanced packaging market has grown from a few percent in 2023 to an expected 7–8% in 2026, driven by adoption of front-end tools for more complex packaging needs.
High sampling rates and new technologies like hybrid bonding are increasing demand for advanced inspection and metrology tools.
R&D investments in macro products are being leveraged across the front-end portfolio, with higher-end tool adoption now reaching about 20% of the segment.
Die stacking and growth in agentic and CPU chips are expected to further expand opportunities in advanced packaging.
Financial performance and operational strategy
Operating margins have improved by 400 basis points over recent years, with gross margins currently in the low 62% range, targeting 63–64% long-term despite memory cost headwinds.
Value-based pricing and operational efficiencies are key levers for margin improvement, while growth in lower-margin businesses like packaging and PCB is factored into long-term models.
Ongoing global investments in facilities and manufacturing are supporting structural growth and operational leverage.
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