LPKF Laser & Electronics (LPK) Investor presentation summary

Advanced packaging opportunity

• AI compute gains increasingly come from chip assembly; high-end packaging revenue is projected at ~US$30bn by 2030, more than double 2025.

• Organic substrates face limits in package size, signal speed and cost; glass is positioned to address all three and support larger packages.

• Glass share of substrates in 2030 is estimated at 30–80%; the EUR 1.7bn 2030 equipment TAM covers LIDE structuring and ABF ablation.

• Glass-core lines add three process steps, two of which are through-glass-via formation and substrate singulation; more than 70% of advanced-packaging customers have selected LPKF tools.

Products and technology position

• NEXAR LIDE 5000 structures through-glass vias; NEXAR Ablate 5000 removes RDL and singulates glass. NEXAR Bond 5000 bonds glass stacks.

• Three of four processes are available for sale; co-packaged optics remains in market assessment, with waveguide writing on the roadmap.

• LIDE forms 5 μm vias at aspect ratios up to 1:50, with a production NG rate below 5 ppm; the process has eight years of field operation.

• Core LIDE process patents were validated in Europe and Korea; enforcement proceedings are under way in China, and Vitrion operates an in-house glass foundry.

Customer and market progress

• A first capacity-expansion order was placed in Q1 2026; a leading Asian packaging manufacturer signed a letter of intent for NEXAR LIDE systems for its first glass-substrate production facility.

• The LOI represents a mid-single-digit million euro volume, with firm orders expected shortly and additional orders anticipated as the facility ramps.

• Three of four process lines are on dated paths toward high volume; the ramp-up year begins in 2027.