J.P. Morgan 54th Annual Global Technology, Media and Communications Conference
Logotype for Nokia Oyj

Nokia (NOKIA) J.P. Morgan 54th Annual Global Technology, Media and Communications Conference summary

Event summary combining transcript, slides, and related documents.

Logotype for Nokia Oyj

J.P. Morgan 54th Annual Global Technology, Media and Communications Conference summary

19 May, 2026

Product innovation and market outlook

  • Announced a differentiated optical portfolio leveraging Infinera integration, with four DSPs and 13 platforms targeting diverse applications, set for market entry in 2027.

  • Volume ramp for new optical products expected in the second half of 2027, with early units in the first half.

  • Strong demand for 800 Gb optical solutions is driving order momentum, with significant design wins in IP networks anticipated to enter the order book later in the year.

  • Capacity expansion in indium phosphide manufacturing underway, with a new six-inch fab ramping up and plans to achieve 25x capacity by 2027, primarily for internal use.

  • Vertical integration and tailored product design are seen as key competitive advantages in both optical and IP switching markets.

Financial performance and order trends

  • Q1 saw €1 billion in AI and cloud orders, nearly 40% of last year’s total, with continued strong order momentum and visibility into demand for the rest of the year.

  • Orders are becoming lumpier due to longer lead times in AI and cloud, while shipments are expected to remain linear.

  • Revenue guidance for IP and optical businesses is 18%-20% growth, with supply chain constraints as the main risk, not demand.

  • Operating margin guidance for 2028 remains at 13%-17%, with ongoing investments in R&D and manufacturing scale.

  • Accelerated realization of synergies from the Infinera acquisition, with a shift in focus to cost of goods sold and earlier synergy capture.

Supply chain and manufacturing

  • Industry-wide supply constraints persist, especially in leading-edge nodes, memory, and indium phosphide, but vertical integration is expected to aid scaling.

  • The new San Jose fab is progressing as planned, with most capacity dedicated to photonic integrated circuits for pluggables.

  • Current capacity expansion is aligned with internal demand forecasts, with no immediate plans to sell components externally.

  • The company is focused on de-risking the indium phosphide ramp and maturing manufacturing processes to meet accelerated market demand.

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