Quantum Computing (QUBT) Investor presentation summary

Investment profile

• Quantum technology market estimates range from $2.5B to $10B+ by 2030, $17.9B by 2034, and $60B to $100B by 2035, according to cited industry sources.

• Competitive advantages cited include room-temperature quantum photonics, vertical integration, scalable manufacturing, and a $1.3B cash-and-investments balance with no debt.

• The platform is designed for room-temperature, miniature, low-power, affordable, robust, and manufacturable quantum products for computing, sensing, and communications.

Technology and manufacturing

• Thin-film lithium niobate (TFLN) photonic integrated circuits underpin four product lines: quantum computing, photonic AI, sensing and imaging, and quantum-secure communications.

• A periodically poled TFLN microring achieved 23x state-of-the-art on-chip nonlinearity in 2019; single-photon nonlinearity technology is patented, with 10+ peer-reviewed publications cited.

• Wafer-scale TFLN manufacturing and proprietary 3D integration combine TFLN and silicon photonics; the first U.S.-based TFLN foundry opened in October 2025, with Fab 2 being built out.

• In-house capabilities span lasers, photonic circuits, electro-optic and nonlinear devices, detectors, advanced packaging, and 2.5D/3D heterogeneous integration.

Products and milestones

• Interim products commercially available today include Dirac-3, NeuraWave, vibrometer, and quantum random number generation, generating revenue alongside longer-term photonic chip development.

• 2026 milestones include publishing Dirac-3 head-to-head results on 10,000-variable optimization benchmarks, launching NeuraWave photonic AI acceleration, and packaging a compact field-deployable vibrometer.

• Planned communications milestones include a quantum key distribution system in 2026, authentication capability in early 2027, and multi-node expansion in 2028.

• TFLN milestones include wafer-scale process development in 2026, a 110 GHz modulator in 2026-2027, and on-chip detector integration and TFLN/silicon photonics 3D integration in 2027-2029.