Silex Microsystems (SILEX) Corporate presentation summary

Strategic expansion in the United States

• Signed a definitive agreement to acquire a 200 mm integrated circuit fab in Mountain Top, Pennsylvania for $40 million, with $10 million at signing and $30 million at closing.

• Acquisition structured as an asset purchase, including facility, real property, infrastructure, and equipment.

• Closing expected around year-end 2027, subject to customary conditions and CFIUS approval.

• Expansion aims to strengthen position as a pure-play MEMS foundry and bring operations closer to major U.S. customers.

• Local U.S. presence enables entry into new segments, such as defense, and reduces currency exposure.

Facility details and operational plans

• Mountain Top facility features a 200 mm wafer fab with ~3,000 sqm cleanroom and ~12,000 sqm for future expansion.

• Cleanroom space is expected to be twice that of the Swedish fab.

• Progressive establishment of MEMS operations through product qualifications and knowledge transfer.

• Approximately 130 employees to be retained, with MEMS experts from Sweden transferring.

Financial impact and investment timeline

• Estimated capex of ~SEK 1,000m for 2026-2027, including purchase consideration.

• Additional annual capex of ~SEK 200m projected for 2028-2030.

• Objective to reach break-even for the U.S. fab by 2029-2030.

• Target to achieve revenue and profitability comparable to the 2025 levels of the Swedish fab by 2034.

• Investments to be funded through existing cash and current debt financing agreements.