SK hynix (000660) Q4 2024 earnings summary
Event summary combining transcript, slides, and related documents.
Q4 2024 earnings summary
7 May, 2026Executive summary
Achieved record-high Q4 revenue of KRW 19.77 trillion, up 12% sequentially and 75% year-over-year, driven by strong AI memory demand, especially HBM and enterprise SSDs; full-year 2024 revenue reached KRW 66.2 trillion, with operating income at KRW 23.5 trillion.
Net profit for Q4 was KRW 8.01 trillion, with a net margin of 41%.
Growth was driven by strong sales of AI memory products, especially HBM and eSSD, with HBM accounting for over 40% of DRAM revenue in Q4.
Company emphasizes sustainable profit through differentiated AI product competitiveness and profitability-oriented operations.
Financial highlights
Q4 operating income rose to KRW 8.08 trillion, with a 41% operating margin; EBITDA was KRW 11.25 trillion (57% margin).
FY2024 revenue totaled KRW 66.2 trillion; operating profit KRW 23.5 trillion; net income for FY2024 reached KRW 19.8 trillion, reversing a prior year loss.
Annual free cash flow reached KRW 13.9 trillion; cash and equivalents at year-end were KRW 14.2 trillion, and interest-bearing debt fell to KRW 22.7 trillion.
Q4 non-operating gain of KRW 1.5 trillion included a KRW 0.62 trillion FX gain and KRW 0.87 trillion from partial sale of System IC Wuxi.
Q4 2024 operating margin reached 41%, up 1 percentage point sequentially and 38 points year-over-year.
Outlook and guidance
2025 memory demand outlook is cautious due to inventory adjustments and geopolitical risks, but AI memory demand is expected to drive growth; DRAM demand projected to grow by mid- to high teens %, NAND by low teens % in 2025.
HBM revenue expected to more than double in 2025, with 12-high HBM3E products to comprise over half of HBM3E shipments by mid-year.
CapEx will increase slightly, focused on HBM and infrastructure, with flexibility to adjust based on market conditions.
Expects continued demand growth for HBM and high-density server DRAM as AI server investments rise globally; plans to expand HBM3E supply, develop HBM4, and transition to advanced processes for DDR5 and LPDDR5.
Anticipates consumer market recovery in the second half of the year, with expanding sales of AI-equipped PCs and smartphones.
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