Verizon (VZ) 53rd Annual JPMorgan Global Technology, Media and Communications Conference summary
Event summary combining transcript, slides, and related documents.
53rd Annual JPMorgan Global Technology, Media and Communications Conference summary
8 Jul, 2026Market trends and financial outlook
Healthy demand for both DRAM and NAND, with strong data center and consumer market recovery as inventories clear.
DRAM and NAND pricing trends have improved, with price inflection driven by supply actions and industry discipline.
Gross margins expected to improve in fiscal Q4, with consumer mix impacting margins but overall positive trajectory.
No significant impact from tariffs on DRAM or NAND; ongoing monitoring of Section 232 review and U.S. manufacturing incentives.
Robust demand for HBM and high-capacity DRAM, with cloud and hyperscaler capital spending supporting future growth.
Technology and product developments
HBM3E 12-high production ramp is progressing well, with crossover to majority demand expected in fiscal Q4.
1-gamma DRAM and Gen9 NAND technology ramps are on track, with strong yield learning and performance positioning.
Data center SSD market share has grown to 15%, with next-gen PCIe Gen 5 SSDs and continued share gains anticipated.
Vertically integrated platforms and self-designed ASICs are enhancing competitiveness in data center storage.
HBM supply for 2025 is sold out, with 2026 negotiations underway and positive customer feedback on ramp execution.
Strategic initiatives and organizational changes
U.S. manufacturing expansion includes projects in Idaho, New York, and Virginia, with customer interest in domestic supply.
Business unit reorganization to four market-focused segments: high-end computing, core data center, client, and automotive/embedded.
Future quarterly disclosures will include revenue, gross margin, and operating margin by segment for greater transparency.
Focus on leveraging green energy and aligning with customer supply chain shifts to the U.S.
Ongoing engagement with U.S. policy to support semiconductor manufacturing and avoid tariff-related disruptions.
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