Amkor Technology (AMKR) investor relations material

Company overview and market position

• Over 55 years of experience in semiconductor packaging and testing, with $6.7B in 2025 revenue and operations in 8 countries.

• 83% of 2025 revenue from advanced packaging, with a 9% CAGR in this segment from 2020-2025.

• Largest US-headquartered OSAT, with new US manufacturing coming soon.

• Trusted by global semiconductor leaders, with 80% of engagements lasting over 30 years.

Strategic initiatives and technology leadership

• Focus on early design engagement and multi-year partnerships to improve predictability.

• Investment in scalable 2.5D and high-density fan-out platforms for repeatable adoption.

• Expansion of geographic footprint, including a new Arizona facility for advanced packaging.

• Turnkey service model reduces cycle time and increases value through integrated design, materials, assembly, and testing.

Financial performance and capital allocation

• 2025 revenue: $6.7B; gross profit: $939M; operating income: $470M; EPS: $1.50.

• Capital expenditures in 2025: $905M, maintaining capital intensity around 11-13%.

• Free cash flow in 2025: $308M; EBITDA: $1,162M; debt/EBITDA ratio: 1.2x.

• Capital allocation prioritizes organic growth, R&D, regional supply chains, and shareholder returns (40-50% of free cash flow, $300M share repurchase authorization).