Amkor Technology (AMKR) investor relations material

Strategic Vision, Industry Transformation, and Market Positioning

• Advanced packaging is now central to system performance and innovation, driving earlier and deeper customer engagement across all end markets, especially in computing, automotive, communications, and IoT.

• Structural changes and AI proliferation are accelerating semiconductor market growth beyond $1 trillion, with advanced packaging content per end system structurally increasing and a projected >20% CAGR in server markets from 2025–2030.

• The business is shifting from transactional engagements to multi-year, strategic partnerships, enabling better capacity planning, smoother ramps, and more resilient business models.

• Early co-development and platform-based technology strategies enable scalable, high-value advanced packaging solutions, with a focus on execution certainty and risk mitigation.

• The company is expanding its global footprint, notably with a new Arizona facility, to support regional supply chains and meet customer demand for geographic flexibility.

Technology Leadership, Customer Engagement, and Operational Execution

• Investments in advanced packaging platforms (flip chip, 2.5D, high-density fan-out) and turnkey solutions drive margin accretion and earnings power.

• Early engagement with customers enables co-development, rapid qualification, and high-volume production, especially for AI, HPC, and CPU-centric programs.

• The Arizona facility will be the most automated site, targeting high-value, low-mix products and aiming for gross margins above 30% at full scale, with production start in 2027.

• The company maintains high utilization by flexibly allocating capacity across regions (Korea, Vietnam, Portugal, U.S.) and leveraging automation and platform reuse, with a global factory network spanning 13M square feet across 9 countries.

• Test services are expected to grow as a percentage of revenue, driven by increased OEM and hyperscaler engagement.

Financial Guidance, Targets, and Capital Allocation

• The financial model is structured in two phases: invest and ramp (2025–2028) and ramp and leverage (2028–2030), with deliberate, demand-led capital deployment.

• Revenue is projected to grow from $6.7B in 2025 to $9B in 2028 and over $11B by 2030, with EPS expanding from $1.50 to over $5 and gross margin rising from 14% to above 22%.

• Arizona phase one is expected to contribute $1B in revenue at >30% gross margin by 2030, with phase two offering further upside as customer commitments solidify.

• Capital intensity will rise to the mid-to-high teens as advanced packaging ramps, supported by a strong liquidity position, government incentives, and customer prepayments, with $4.1B in available liquidity as of March 2026.

• The company remains committed to growing its dividend and returning 40–50% of free cash flow to shareholders, while maintaining a long-term debt-to-EBITDA target of 1.5x or below.