Amkor Technology Inc
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services; various forms of final test services; wafer processing services comprising wafer probing under thermal and humidity controlled environment; wafer bumping services in various technologies, such as copper pillar and wafer level fan-out; and other assembly services that include IC package design and development, packaging, and drop shipment services.
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United States of America