Amkor Technology (AMKR) investor relations material

Company overview and market position

• Over 55 years of experience in semiconductor packaging and testing, with $6.7B in 2025 revenue and operations in 8 countries.

• 83% of 2025 revenue from advanced packaging, with a 9% CAGR in this segment from 2020–2025.

• Largest US-headquartered OSAT, with US manufacturing expansion planned.

• Broad geographic footprint with 13 million square feet of manufacturing space across Asia, Europe, and the US.

• Trusted by leading global semiconductor companies, including NVIDIA, Samsung, Qualcomm, and TSMC.

Strategic focus and growth drivers

• Strategy centers on technology leadership, geographic expansion, and strong industry partnerships.

• Positioned to support megatrends in 5G, HPC, AI, automotive electronics, and IoT devices.

• Turnkey service offering reduces cycle time and increases value through design, materials, assembly, and testing.

• Early engagement with OEMs and semiconductor firms enhances packaging innovation.

• Investments target advanced packaging, regional supply chains, and US manufacturing.

Financial performance and capital allocation

• 2025 revenue reached $6.7B, with gross margin at 14.0% and operating margin at 7.0%.

• EBITDA for 2025 was $1,162M, with a debt/EBITDA ratio of 1.2x.

• Free cash flow in 2025 was $308M, with capital expenditures of $905M.

• Capital allocation prioritizes organic growth, strategic investments, and maintaining leverage at or below 1.5x.

• Shareholder returns include a 40–50% free cash flow payout target, regular dividends, and a $300M buyback program.