BASiC Semiconductor
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BASiC Semiconductor (9971) investor relations material

BASiC Semiconductor H1 2026 earnings summary

Complete event summary combining all related documents: earnings call transcript, report, and slide presentation.
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H1 2026 earnings summary28 Aug, 2026

Executive summary

  • Revenue grew 15.5% year-over-year to RMB120.6 million, driven by strong sales in SiC discrete devices and industrial-grade SiC power modules.

  • Gross profit margin turned positive, improving from -28.8% to 2.8%, with gross profit of RMB3.3 million.

  • Net loss narrowed by 8.8% to RMB161.6 million; adjusted net loss (non-IFRS) decreased by 15.1% to RMB111.8 million.

  • Significant R&D progress with new product launches in automotive, industrial, and consumer electronics sectors.

  • IPO completed in July 2026, raising HK$866 million; H shares listed on the Hong Kong Stock Exchange.

Financial highlights

  • Revenue: RMB120.6 million, up 15.5% year-over-year; SiC discrete devices up 161.1%, industrial-grade SiC power modules up 2,825.1%.

  • Gross profit: RMB3.3 million (gross margin 2.8%), compared to a gross loss of RMB30.1 million (margin -28.8%) last year.

  • Net loss: RMB161.6 million, improved from RMB177.2 million year-over-year; adjusted net loss: RMB111.8 million.

  • Cash and cash equivalents: RMB154.3 million, up from RMB98.7 million at year-end 2025.

  • Bank and other borrowings: RMB414.1 million, up from RMB324.3 million.

Outlook and guidance

  • Plans to increase R&D investment, expand product portfolio, and accelerate product development across SiC chip design, wafer fabrication, and module packaging.

  • Focus on expanding into renewable energy, industrial, NEV, AI data centers, and consumer electronics markets.

  • Intends to leverage overseas R&D and business teams for international market growth.

  • Capacity expansion underway at Pingshan and Zhongshan bases, with transition to 8-inch wafer platforms.

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