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Edge27 Aug 2024
The Silicon Empire: TSMC's Revolution and Morris Chang's Legacy
The story of how Morris Chang founded one of the most important companies in history – the world's largest semiconductor foundry – TSMC.
BE Semiconductor Industries
BE Semiconductor Industries (BESI) investor relations material
BE Semiconductor Industries Q3 2026 earnings summary
Complete event summary combining all related documents: earnings call transcript, report, and slide presentation.Q3 2026 earnings summary22 Oct, 2026
Executive summary
Q3-26 revenue rose 113.6% YoY to €283.4 million, orders increased 96.1% to €342.6 million, and net income rose 323.7% to €107.2 million.
AI and advanced-packaging demand drove momentum; FY-26 revenue and orders are expected to exceed €1 billion.
Financial highlights
Q3-26 revenue was €283.4 million, up 13.4% QoQ and 113.6% YoY; gross margin was 65.2%, up 3.0 points YoY.
Q3-26 operating income was €129.7 million, EBITDA €139.9 million and net income €107.2 million; net income increased 20.4% QoQ and 323.7% YoY.
9M-26 revenue was €718.1 million, up 69.0% YoY; orders reached €905.2 million, up 108.3%, and net income was €247.8 million, up 179.1%.
9M gross-margin improvement reflected favorable product mix and price increases passed through to offset higher supply-chain costs.
Outlook and guidance
Q4-26 revenue is expected flat to +/-5% versus Q3; gross margin is forecast at 63%-65%, with operating expenses up 5%-10% QoQ, mainly due to strategic consulting costs.
At the midpoint of Q4 guidance, FY-26 revenue is projected at €1,002 million, up 69.4% from 2025; gross margin is projected at 64.7%.
Favorable Q4 order momentum is expected across traditional and wafer-level assembly, supported by AI capacity expansion, data centers, photonics and market-share gains.
Mainstream HBM hybrid-bonding timing depends on end customers; adoption is expected across stack heights over the next two years. GPU qualification is anticipated this year, potential orders next year and volume thereafter.
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Latest events from BE Semiconductor Industries
- AI-driven demand and hybrid bonding leadership fuel record growth and higher long-term targets.BESI
Investor presentation - Q2-26 saw record revenue, net income, and orders, driven by robust AI and datacenter demand.BESIQ2 2026
- Revenue and margin targets raised as AI and hybrid bonding drive rapid growth.BESIInvestor Day 2026
- Revenue, orders, and net income surged, driven by AI and hybrid bonding demand, with strong outlook.BESIQ1 2026
- Hybrid bonding and advanced packaging fuel growth, with strong financials and global expansion.BESIInvestor presentation
- Q4 2025 revenue and orders surged on AI/datacenter demand, supporting strong 2026 growth outlook.BESIQ4 2025
- Sequential revenue growth and strong AI demand offset mobile weakness, but margins declined.BESIQ2 2025
- Q3-24 revenue and net income rose sharply, driven by advanced packaging and hybrid bonding demand.BESIQ3 2024
- Orders surged 64.5% year-over-year as AI and advanced packaging demand accelerated.BESIQ2 2024
Next BE Semiconductor Industries earnings date
Q4 202625 Feb, 2027
BE Semiconductor Industries
Next BE Semiconductor Industries earnings date
Q4 202625 Feb, 2027
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Frequently asked questions
Semiconductor Assembly Specialists
BE Semiconductor Industries N.V. (Besi) specializes in the development and manufacturing of semiconductor assembly equipment. The company's products are used in the assembly of semiconductor chips for a variety of applications, including mobile devices, computing, automotive, and industrial electronics. They have clients in the semiconductor manufacturing industry, providing equipment that supports the production of high-performance and miniaturized electronic components. The company is headquartered in Duiven, the Netherlands, and its shares are listed on the Euronext Amsterdam.
Product Portfolio and Clients
Besi’s clientele includes some of the largest semiconductor manufacturers in the world, who rely on the company’s equipment to produce cutting-edge chips that power a vast array of electronic products. The company’s portfolio of products is focused on advanced semiconductor packaging, offering solutions that are critical for the miniaturization and enhanced performance of electronic components. The company’s core product lines include die attach systems, packaging systems, and plating systems.
Die Attach Systems: These are crucial in the initial stages of semiconductor assembly, where the semiconductor die is attached to the substrate or package. Besi’s die attach equipment supports high precision and high-speed processes, which are vital for the production of advanced packages, such as those used in smartphones and other high-performance devices.
Packaging Systems: Besi provides a range of packaging solutions designed to meet the demands of increasingly complex and miniaturized semiconductor packages. The company’s packaging systems are used for various technologies including wafer-level packaging, flip-chip, and fan-out packaging. These systems enable the production of chips that offer greater functionality while occupying less space, which is essential for modern electronic devices.
Plating Systems: Besi’s plating systems are used to deposit metal layers on semiconductor wafers, a process essential for creating electrical connections in semiconductor devices. The company’s equipment supports advanced plating techniques required for fine-pitch interconnections, which are critical for high-density electronic components.