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Disco Corporation is amanufacturer in the precision tools sector, with a specific focus on the semiconductor production industry. The company specializes in the development, manufacture, and sale of cutting-edge equipment essential for semiconductor manufacturing processes. Its product lineup includes dicing saws, laser saws, grinders, polishers, and wafer mounters, all designed to meet the rigorous standards of precision required for silicon wafer processing and other semiconductor materials. The company is headquartered in Tokyo, Japan, and its shares are listed on the Tokyo Stock Exchange.
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Q1 2025
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Q4 2024
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Ticker symbol
6146
Country
🇯🇵 Japan