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Edge16 Oct 2026
Winner, Winner: The Chicken McNugget Story
How a 1940s breeding contest, a Cornell food scientist, and a hedge by Ray Dalio helped McDonald's turn the Chicken McNugget into a fast-food icon.
HANMI Semiconductor
HANMI Semiconductor (042700) investor relations material
HANMI Semiconductor Q3 2026 earnings summary
Complete event summary combining all related documents: earnings call transcript, report, and slide presentation.Q3 2026 earnings summary13 Nov, 2026
Executive summary
9M 2026 revenue was KRW 483,079 million and operating income KRW 229,606 million; net income was KRW 162,400 million, below the prior-year 9M results.
AI and HBM packaging demand underpin product development and factory investment, including dedicated hybrid-bonder capacity and expanded AI-packaging equipment offerings.
Financial highlights
9M revenue was KRW 483,079 million versus KRW 493,670 million in 9M 2025; operating income was KRW 229,606 million versus KRW 285,470 million.
9M net income was KRW 162,400 million versus KRW 185,149 million in 9M 2025; basic EPS was KRW 1,712 versus KRW 1,952.
Total assets were KRW 905,969 million at Sept. 30, 2026, versus KRW 813,332 million at 2025 year-end; equity was KRW 781,619 million versus KRW 690,328 million.
Cash and cash equivalents were KRW 140,066 million, down from KRW 276,235 million at 2025 year-end.
Outlook and guidance
HBM4/4E TC-bonder supply is expected to expand; a Wide TC Bonder is in development for wider-die stacking, alongside hybrid bonders for HBM and AI system-chip packaging.
Five AI system-chip packaging bonder models are in the lineup, with deliveries to Taiwan’s AI-packaging market expected from 2027.
Factory 7, a KRW 57,824 million hybrid-bonder facility, had a planned investment period through Nov. 30, 2026; Factory 8, a KRW 56,000 million site, was scheduled for acquisition on Feb. 17, 2027.
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Latest events from HANMI Semiconductor
- Revenue and profit fell YoY, but investments in HBM and AI equipment support future growth.042700
Q2 2026 - Revenue and profit fell amid industry headwinds, but financial strength and R&D investment remain solid.042700Q2 2025
- Revenue and operating profit surged on strong HBM and AI equipment demand, with robust margins.042700Q3 2024
- Net income rose to KRW 185.1 billion on KRW 493.7 billion revenue, with strong export growth.042700Q3 2025
- Revenue and net income surged on strong HBM and AI equipment demand, with margin expansion.042700Q2 2024
- Strong growth in semiconductor equipment sales driven by innovation and industry demand.042700Q1 2026
- Record results and strong outlook as demand for advanced semiconductor equipment surges.042700Q4 2025
- Q1 2025 revenue and profit surged on strong HBM/AI equipment demand and robust capital returns.042700Q1 2025
- Record HBM demand propelled Hanmi to historic sales and profit, with strong global expansion.042700Q4 2024
Next HANMI Semiconductor earnings date
Q4 202627 Jan, 2027
HANMI Semiconductor
Next HANMI Semiconductor earnings date
Q4 202627 Jan, 2027
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Frequently asked questions
HANMI Semiconductor Co., Ltd. is a South Korea-based company that designs and manufactures semiconductor equipment. The company specializes in developing equipment for semiconductor back-end processes, including devices for sawing, sorting, inspection, and packaging of semiconductor components. HANMI Semiconductor’s products support industries such as consumer electronics, automotive, and telecommunications by enhancing the efficiency and precision of semiconductor manufacturing. Its equipment solutions are used by semiconductor manufacturers globally, contributing to advancements in microelectronics production. The company is headquartered in Suwon, South Korea, and its shares are listed on the KOSDAQ.