Kostecsys (355150) investor relations material

Executive summary

• 9M revenue was ₩15.77bn vs ₩9.51bn; operating income was ₩3.08bn vs a ₩1.05bn loss, and net income was ₩2.10bn vs a ₩1.35bn loss.

• Growth plans center on thermal-management products for power semiconductors and AI infrastructure, alongside established RF, optical-communications and laser packaging businesses.

Financial highlights

• Q3 revenue was ₩4.97bn vs ₩3.00bn; operating income was ₩761m vs a ₩320m loss, and net income was ₩256m vs a ₩527m loss.

• 9M gross profit was ₩4.56bn vs ₩519m; EPS was ₩273 vs a loss of ₩184.

• 9M operating cash flow was ₩2.05bn vs ₩515m; investing cash outflow was ₩1.50bn vs ₩15.78bn, and ending cash was ₩845m vs ₩277m.

• Total assets were ₩57.63bn and equity ₩29.75bn at September 30, 2026, compared with ₩56.01bn and ₩22.30bn at year-end 2025.

Outlook and guidance

• Plans include expanding power-semiconductor and AI-infrastructure applications for spacers, base plates, high-thermal metal-ceramic packages, cooling structures and advanced packaging components.

• Spacer commercialization depends on customer evaluations, supplier registration, quotations and production approvals; some customer projects resumed and new discussions were underway.

• Development priorities include Block Bonding, TGV-ICP micro copper pillars and thermal-management solutions linking materials, structures, packaging and cooling.