Kostecsys (355150) investor relations material

Executive summary

• The company specializes in advanced semiconductor packaging and thermal management solutions, focusing on RF, power, and optoelectronic applications, with a growing emphasis on AI, data centers, and electric vehicles.

• Recent years saw expansion into high-growth markets, new product launches, and significant R&D investments, including proprietary materials and next-gen packaging technologies.

• The company completed a merger and KOSDAQ listing, with stable management and a shift in major shareholder due to intra-family stock transfer.

Financial highlights

• Revenue for H1 2026 was KRW 10,791 million, down from KRW 15,220 million in H1 2025.

• Operating income rose sharply to KRW 2,314 million from KRW 184 million year-over-year.

• Net income improved to KRW 1,847 million from a net loss of KRW 562 million in the prior year.

• Basic and diluted EPS for H1 2026 were KRW 242, compared to KRW -76 in H1 2025.

• Cash and cash equivalents increased to KRW 2,195 million from KRW 1,490 million at year-end 2025.

Outlook and guidance

• The company aims to expand its presence in AI, EV, and high-performance computing markets, leveraging proprietary thermal packaging platforms.

• Ongoing R&D and customer qualification processes are expected to drive future growth in power semiconductor and advanced packaging segments.