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Powertech Technology Inc. (PTI) is a Taiwan-based company that specializes in providing packaging and testing services for integrated circuits and semiconductor components. The company's core activities include wafer-level packaging, wafer testing, IC assembly, final testing, burn-in, and laser mark printing. PTI offers a variety of packaging solutions such as high pin-count thin small outline package (TSOP), quad flat no-leads (QFN), multi-chip packaging (MCP, S-MCP), and ball grid array (wBGA, FBGA). These services cater to applications in mobile memory, system-in-package, and automotive electronics. The company is headquartered in Hsinchu, Taiwan, and its shares are listed on the Taiwan Stock Exchange.