Qnity Electronics (Q) investor relations material

Business overview and growth drivers

• Largest pure-play material solution provider for the semiconductor ecosystem, serving front-end to back-end needs, with strong positions in advanced packaging, AI PCBs, and thermal/EMI shielding.

• Growth fueled by AI, high-performance computing, and advanced connectivity trends, with a local-for-local model supporting global customers.

• Two business segments: semiconductor (40% advanced nodes, growing 20% in H1) and interconnect (30% advanced tech, growing 50%+ YoY).

• Industry investments in leading-edge capacity and advanced packaging bode well for continued outperformance through 2027.

Strategic objectives and future outlook

• Focus on establishing a track record of steady, consistent execution as a new public company.

• Outperforming industry MSI, nearly doubling it in H1 due to advanced technology content gains.

• Interconnect segment outpacing semiconductor growth, driven by thermal management and advanced packaging, with both segments expected to grow strongly.

• AI-led transformation expected to shift from data centers to edge and physical AI, expanding innovation from chip to system level.

• Anticipates strong, sustainable growth as AI applications proliferate across devices, vehicles, and machines.

Market trends and demand environment

• Raised industry wafer start forecast to high single digits for 2026, reflecting rising utilization rates, especially in advanced logic and HBM DRAM.

• Strongest growth from advanced technologies, but also solid gains in mainstream logic and PCBs.

• Advanced nodes in the semiconductor portfolio are reaching 45-50% share earlier than expected, with advanced packaging and thermal management driving interconnect growth.

• Growth momentum expected to continue, contingent on customers bringing new capacity online.

• Well-positioned to support scaling demand into 2027 and 2028 through co-investment in capacity.