SÜSS MicroTec (SMHN) investor relations material

Business and portfolio

• Semiconductor front-end and advanced-backend technology provider with a 75-year innovation and growth track record; global customer base, with the largest share of business in Asia.

• Two focused segments: Photomask Solutions and Advanced Backend Solutions, spanning cleaning, coating, imaging and bonding processes.

• Portfolio covers temporary, permanent and hybrid bonding; positioned as a market leader in temporary bonding and debonding.

• GT200 launches as a 200 mm wafer-cleaning platform combining patented technologies with hybrid single-wafer and bath cleaning.

• €45m planned investment in a Karlsruhe application and development center through 2028; R&D and application activities are to relocate there.

H1 and Q2 2026 performance

• H1 order intake €410.0m, up 145.8% YoY; sales €202.8m, down 23.9% YoY.

• H1 gross profit margin 37.2%, down 0.8% YoY; EBIT margin 7.0%, down 9.5 pp YoY.

• Q2 order intake €260.7m and sales €116.2m; gross profit margin 38.0% and EBIT margin 9.0%.

• Q2 sales and profitability were higher than Q1; prior-year figures were adjusted.

2026 outlook

• FY2026 guidance: sales €425–485m, gross profit margin 35–37%, and EBIT margin 8–10%; FY2025 actuals were €503.2m, 35.7% and 13.1%, respectively.

• 2026 is expected to be a transition year, with lower sales reducing fixed-cost coverage and higher R&D expenses pressuring EBIT margin; gross profit margin is expected to remain broadly stable.