Synopsys (SNPS) investor relations material

Vision for the future and industry transformation

• Marking the first year of a new era following a major merger, with a mission to transform and lead in engineering solutions from silicon to systems.

• Emphasis on the convergence of silicon and system users, reflecting the simultaneous emergence of mega trends like AI, compute, and pervasive intelligence.

• AI and compute are central to enabling new possibilities, including physical AI and embodied intelligence, impacting industries from health to energy.

• The next decade is defined by the need for convergence to address complex, simultaneous disruptions in technology.

• Humanoid robots and physical AI are expected to fill labor gaps and augment the workforce, with deployment in production environments anticipated within a few years.

Key investment areas and technology strategy

• Three strategic investment areas: co-design, digital twin, and agentic AI, each addressing critical constraints and complexity in engineering.

• Co-design is evolving to include both vertical (within domains) and horizontal (across domains) collaboration, reducing overdesign and optimizing across electronics, mechanical, and thermal domains.

• Digital twin platforms are being developed to virtualize silicon, electronics, and environments, enabling faster, cost-effective, and more accurate product development.

• Agentic AI is advancing from copilots to autonomous multi-agent systems, with the first L4 agentic workflow announced, enabling dynamic orchestration of engineering tasks.

• Partnerships with industry leaders like NVIDIA, Microsoft, and AMD are accelerating compute, simulation, and AI integration across the product portfolio.

Product innovation and customer impact

• Multi-Physics Fusion technology integrates electromagnetics, thermal, and mechanical analysis into design platforms, reducing iterations and overdesign.

• New digital twin platforms are open, cloud-based, and ecosystem-driven, supporting software-defined hardware verification and updates.

• AI-driven automation is transforming analog and digital design, verification, and test, with significant reductions in design cycles and improved productivity.

• Advanced packaging and 3DIC Compiler platforms enable unified prototyping, construction, and sign-off for complex multi-die systems, leveraging native multi-physics integration.

• Hardware platforms like ZeBu and HAPS, combined with modular software innovations, address the verification demands of AI superchips and large-scale systems.