Tokyo Seimitsu
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Tokyo Seimitsu (7729) investor relations material

Tokyo Seimitsu Q2 2027 earnings summary

Complete event summary combining all related documents: earnings call transcript, report, and slide presentation.
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Q2 2027 earnings summary4 Nov, 2026

Executive summary

  • 1H orders, sales and all profit measures reached fiscal-half records; orders rose 72.3% to ¥138,960 million, led by semiconductor equipment demand for HPC, Generative AI and HBM.

  • FY2027/3 forecasts were raised to ¥192,000 million in sales and ¥45,000 million in operating profit; both are expected to meet MTP quantitative targets.

  • Demand outlook remains strong, with equipment markets expected to expand through at least CY2028; component procurement risks remain under close watch.

Financial highlights

  • 1H sales were ¥92,399 million, up 19.9% YoY; gross profit was ¥39,503 million versus ¥31,190 million.

  • 1H operating profit rose 38.2% to ¥20,341 million; operating margin was 22.0%, up 2.9 points.

  • 1H recurring profit rose to ¥21,146 million from ¥14,978 million; net profit attributable to owners rose to ¥15,489 million from ¥9,612 million.

  • 2Q sales reached a quarterly record of ¥55.7B, up 21% YoY; operating profit was ¥14.4B, up 42%, with a 25.9% margin.

Outlook and guidance

  • FY2027/3 forecasts: sales ¥192,000 million, operating profit ¥45,000 million, recurring profit ¥45,500 million and parent-attributable net profit ¥32,000 million.

  • FY2027/3 SPE sales are forecast at ¥150.5B, up 18% YoY; Metrology sales at ¥41.5B, up 7%.

  • SPE orders are expected to remain very strong in 2H, with FY orders forecast at ~¥220.0B, up 80% YoY; Metrology FY orders are expected to rise 10% YoY despite seasonal 2H decline.

  • Forecast assumes ¥150/US$; stated FX impact is minimal due to the high ratio of yen-based business.

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Frequently asked questions

Tokyo Seimitsu Co., Ltd., operating under the brand name ACCRETECH, is a Japanese company specializing in the development, manufacturing, and sale of semiconductor production equipment and precision measuring instruments. The company's product lineup includes probing machines, dicing machines, polish grinders, chemical mechanical planarizers (CMPs), wafer edge grinding machines, and various types of sensors, among others. These products are essential for the semiconductor manufacturing process, offering solutions that cater to the precise needs of semiconductor producers worldwide. The company is headquartered in Hachioji, Tokyo, Japan, and its shares are listed on the Tokyo Stock Exchange.