Winbond Electronics
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Winbond Electronics (2344) investor relations material

Winbond Electronics Q3 2026 earnings summary

Complete event summary combining all related documents: earnings call transcript, report, and slide presentation.
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Q3 2026 earnings summary3 Nov, 2026

Executive summary

  • 3Q26 consolidated net sales reached NT$82,331m, up 37.6% QoQ and 278.2% YoY; operating margin rose to 53.2%.

  • Memory capacity utilization remained ~100%, with strong AI-related demand supporting the memory upcycle and profitability momentum.

Financial highlights

  • Gross profit was NT$58,101m, up 46.6% QoQ and 471.5% YoY; gross margin was 70.6%, up 4 ppts QoQ and 24 ppts YoY.

  • Operating profit was NT$43,784m, up 51.1% QoQ and 1,082.4% YoY; operating expenses were NT$14,317m, up 34.2% QoQ.

  • Net income was NT$35,138m, up 45.2% QoQ and 1,201.1% YoY; net profit margin was 42.7%.

  • EPS was NT$7.58 for 3Q26; 3Q26 YTD EPS was NT$15.32. EBITDA was NT$51,781m.

Outlook and guidance

  • High-density NOR demand and pricing momentum are expected to remain strong into 2027; SLC NAND pricing outlook is also favorable, supported by design-ins.

  • Further upside in 4Q contract pricing is expected for Customized Memory Solution; constrained supply is expected to persist into 2027.

  • DDR4 and LPDDR4 series are planned as key 2027 focus areas; CUBE remains on track for mass production in 2027.

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Frequently asked questions

Winbond Electronics Corporation is a Taiwan-based company established in 1987, specializing in the production of semiconductors and various types of integrated circuits (ICs). Its product lineup includes dynamic random-access memory (DRAM), static random-access memory (SRAM), serial flash memory, microcontrollers, and Super I/O chips. The company is headquartered in Taiwan, and its shares are listed on the Taiwan Stock Exchange.