Winbond Electronics
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Winbond Electronics (2344) investor relations material

Winbond Electronics H1 2026 earnings summary

Complete event summary combining all related documents: earnings call transcript, report, and slide presentation.
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H1 2026 earnings summary6 Aug, 2026

Executive summary

  • Net sales in 2Q26 reached NT$59,843M, up 56.4% QoQ and 184.7% YoY, with net income at NT$24,199M, a 139.2% YoY increase.

  • Revenue for the six months ended June 30, 2026, surged to NT$98.1 billion, up from NT$41.0 billion year-over-year, with net income reaching NT$34.3 billion compared to a net loss of NT$2.6 billion in the prior year period.

  • Memory business drove growth, with CMS revenue up 78% QoQ and over 400% YoY, and Flash revenue up 65% QoQ and 176% YoY.

  • Gross margin improved to 66.2% in 2Q26 and 62% for the six months, reflecting higher selling prices and reversal of inventory write-downs.

  • Profitability hit record highs, supported by strong AI, automotive, and infrastructure demand.

Financial highlights

  • Operating profit for 2Q26 was NT$28,979M, up 130.9% QoQ, with operating margin at 48.4%.

  • EBITDA for 2Q26 was NT$33,643M, more than double YoY.

  • Free cash flow in 2Q26 was NT$18,134M, with cash and equivalents at NT$61,826M.

  • Basic EPS for the six months was NT$7.65, up from a loss per share of NT$0.53 in the prior year.

  • Total assets increased to NT$293.0 billion from NT$179.6 billion a year earlier.

Outlook and guidance

  • High-density NOR and SLC NAND demand expected to sustain pricing uptrend through 2026 and beyond.

  • DRAM supply remains tight, with AI-driven demand supporting further price increases into 2H26 and 2027.

  • 16nm capacity ramp and KH Fab Module B expansion to contribute from 2027.

  • The company is reassessing equipment useful lives to align with evolving product portfolios and market demand.

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Frequently asked questions

Winbond Electronics Corporation is a Taiwan-based company established in 1987, specializing in the production of semiconductors and various types of integrated circuits (ICs). Its product lineup includes dynamic random-access memory (DRAM), static random-access memory (SRAM), serial flash memory, microcontrollers, and Super I/O chips. The company is headquartered in Taiwan, and its shares are listed on the Taiwan Stock Exchange.