Yamaha Motor (7272) investor relations material

Business overview and strategy

• Robotics business generated ¥107.4 billion in 2025, focusing on SMT systems and semiconductor manufacturing equipment.

• Integration of robotics divisions enables comprehensive automation and optimization across manufacturing processes.

• Medium-term plan targets 18% revenue CAGR for SEMI and 15% for SMT segments by 2027.

• Strategic focus on automotive, electric devices, and communication infrastructure markets.

• Vision emphasizes delivering advanced automation solutions globally with a one-stop smart solution approach.

SEMI business and market positioning

• SEMI business provides high-speed, high-precision back-end semiconductor process solutions.

• Offers a full suite of equipment: flip chip bonders, die/wire bonders, molding, and inspection systems.

• Global network includes manufacturing and service sites in Japan, China, USA, Europe, and Southeast Asia.

• Revenue from advanced semiconductor applications is a primary growth driver.

• Market expected to surpass $1 trillion in 2026, driven by AI and advanced packaging demand.

Growth initiatives and technology development

• Investments focus on advanced packaging, HBM, and silicon photonics to capture AI-driven growth.

• New platform models like UTC-RZ1 wire bonder and MS-R series molding systems enhance productivity and efficiency.

• Panel-level packaging and next-gen process technologies under development for advanced semiconductors.

• Active alignment technology for silicon photonics targets high-precision optical connections.

• Collaboration with universities and research institutes fosters innovation in environmentally friendly and automated processes.