4DS Memory (4DS) Q2 2025 TU earnings summary

Executive summary

• Significant technical progress achieved with Fifth and Sixth Platform Lots, focusing on scaling memory cell arrays from 60nm to 20nm, with key process optimizations identified and implemented.

• Entered a 15-month, $4.5 million Design Agreement with Infineon to develop a custom ReRAM memory test chip, advancing commercialization efforts.

• Active participation in industry events and strategic meetings, including securing the Infineon agreement.

Financial highlights

• Cash balance at 31 December 2024 was $4.625 million, down from $6.312 million at 30 September 2024.

• Net cash used in operating activities for the quarter was $1.647 million, including contractual payments to imec.

• Payments to related parties totaled $145k for the quarter, covering executive and director remuneration and advisory fees.

Outlook and guidance

• Sixth Platform Lot with 20nm memory cell array expected to be manufactured and analyzed in 1H 2025, with successful scaling positioning the technology as a potential generational memory.

• Funds from recent capital raising to support Infineon agreement, ongoing imec development, and general working capital.