28th Annual Needham Growth Conference Virtual
Logotype for Aehr Test Systems

Aehr Test Systems (AEHR) 28th Annual Needham Growth Conference Virtual summary

Event summary combining transcript, slides, and related documents.

Logotype for Aehr Test Systems

28th Annual Needham Growth Conference Virtual summary

13 Jan, 2026

Business and Company Overview

  • Nearly 50 years as a leader in semiconductor test, specializing in reliability and burn-in for both package-level and wafer-level devices, with a unique position in wafer-level burn-in technology and a global customer base including major tech and semiconductor firms.

  • State-of-the-art 50,000+ sq. ft. facility in Fremont, CA, supporting high-volume production, with global contract manufacturing and capacity exceeding current revenue levels.

  • Manufacturing processes have passed Tier 1 customer qualifications.

  • Installed base includes major AI processor, automotive, data center, silicon photonics, and cell phone supply chain companies, with a growing footprint this year.

Product Innovation and Differentiation

  • Offers Sonoma and proprietary FOX systems, enabling package and wafer-level burn-in, with full turnkey solutions including equipment, software, automation, and consumables.

  • FOX-XP system enables multi-wafer parallel test and burn-in, supporting up to 18 wafers in parallel, reducing equipment cost and fab footprint while increasing yield.

  • Holds extensive global patents on wafer-level burn-in technology, including temperature control and probe contact; systems can test up to 20 wafers simultaneously.

  • WaferPak contactors are patented, high-margin, and required for each new device design, supporting recurring revenue from consumables.

  • Lead AI customer transitioning to full automation, with benchmarks underway for major AI accelerator companies, potentially driving significant system orders.

Product Portfolio and Applications

  • FOX-XP: High-volume, multi-wafer test and burn-in system with up to 18 blades and 360 wafer capacity.

  • FOX-NP: Dual-wafer system for new product introduction, engineering, and low-volume production.

  • Sonoma platform: Largest installed base for high-power packaged part burn-in, especially for AI processors.

  • WaferPak contactors enable low-cost, high-density, and high-temperature testing.

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