28th Annual Needham Growth Conference Virtual
Logotype for Aehr Test Systems

Aehr Test Systems (AEHR) 28th Annual Needham Growth Conference Virtual summary

Event summary combining transcript, slides, and related documents.

Logotype for Aehr Test Systems

28th Annual Needham Growth Conference Virtual summary

13 Apr, 2026

Business and Company Overview

  • Nearly 50 years as a leader in reliability and burn-in testing for semiconductors, specializing in both wafer-level and package-level systems for a global customer base including major tech and semiconductor firms.

  • Large installed base across AI processors, automotive, data centers, silicon photonics, and major cell phone supply chains.

  • State-of-the-art 50,000+ sq. ft. facility in Fremont, CA, handles final assembly, testing, and high-volume production, supporting global contract manufacturing.

  • Manufacturing processes have passed Tier 1 customer qualifications.

  • Production capacity exceeds current forecasts, able to ship up to 20 wafer-level and 20 package-level systems monthly.

Product Innovation and Technology

  • Offers turnkey solutions including equipment, software, automation, and consumables, with proprietary IP and global patents covering wafer-level test, temperature control, and probe contact.

  • FOX-XP system enables multi-wafer parallel test and burn-in, supporting up to 18 wafers in parallel and reducing equipment cost and fab footprint.

  • WaferPak contactors are patented, high-margin consumables tailored to each device design, enabling high-precision, high-density, and high-temperature testing.

  • Automation enhancements allow for efficient, hands-free processing of multiple wafers, reducing cycle overhead.

  • Systems provide functional testing and validation, ensuring high reliability and safety for critical applications.

Product Portfolio and Applications

  • FOX-XP: High-volume, multi-wafer test and burn-in system with up to 18 blades and 360 wafer capacity.

  • FOX-NP: Dual-wafer system for new product introduction, engineering, and low-volume production.

  • Sonoma platform: Largest installed base for high-power packaged part burn-in, especially for AI processors.

  • WaferPak contactors enable low-cost, high-density, and high-temperature testing.

  • Systems support a range of semiconductor devices, including AI, memory, and photonics.

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