Aehr Test Systems (AEHR) Corporate presentation summary

Technology leadership and product offerings

• Over 45 years of expertise in wafer-level and packaged part test and burn-in systems, with unique full-wafer solutions and massively parallel, high-power capabilities.

• FOX-XP system enables multi-wafer, high-throughput testing with up to 18 wafers in parallel, reducing equipment costs and fab footprint.

• Proprietary WaferPak contactors and aligners provide high-precision, high-density, and recurring revenue opportunities.

• Systems support a wide range of power and temperature requirements, with advanced automation and integration for factory environments.

• Extensive patent portfolio covers wafer-level temperature control, probe contact, and power management innovations.

Manufacturing capacity and customer base

• State-of-the-art Fremont, CA facility supports up to 400 wafer-level and 20 packaged-part systems monthly, with rigorous quality controls.

• Thousands of systems shipped globally, serving leading semiconductor, technology, and defense companies.

• Manufacturing and quality processes have passed Tier 1 customer qualifications.

Market drivers and growth opportunities

• Demand driven by AI processors, data center infrastructure, electric vehicles, clean energy, and 5G, all requiring advanced test and burn-in.

• Heterogeneous integration and 3D stacking trends increase the need for wafer-level test and known good die.

• New opportunities in NAND flash and DRAM wafer-level test and burn-in for mission-critical and high-bandwidth applications.