Aeluma (ALMU) 16th Annual LD Micro Invitational Conference summary

Vision and technology overview

• Aims to deliver high-performance semiconductor chips with scalable manufacturing, bridging the gap between specialized performance and mainstream volume.

• Achieved breakthroughs in compound semiconductor materials, notably indium gallium arsenide (InGaAs) on silicon, enabling large-scale production.

• Technology validated by U.S. government, defense, aerospace, and commercial customers, with over 30 customer engagements.

• Holds 36 issued and pending patents, with proprietary process recipes and trade secrets.

• Manufacturing approach is capital-light, leveraging outsourced partners while retaining key proprietary steps in-house.

Market applications and industry context

• Innovations enable applications in consumer electronics, data centers, automotive, robotics, defense, and quantum technologies.

• Addresses supply chain constraints by moving from small, fragile indium phosphide substrates to scalable silicon wafers up to 300 mm.

• Technology supports high-volume, automated manufacturing, reducing costs by 5x-10x compared to traditional methods.

• Positioned to meet growing demand in AI infrastructure, with hyperscaler investments projected to exceed $1 trillion by 2029.

• Non-indium phosphide approach circumvents current substrate shortages affecting the industry.

Product portfolio and scalability

• Offers large-area InGaAs photodiodes, high-speed photodiodes for data center interconnects, imaging arrays for defense, and quantum dot lasers.

• Products are generally drop-in replacements for existing InGaAs or indium phosphide-based solutions, minimizing integration barriers.

• Manufacturing can scale rapidly in line with fab partner capacity, leveraging existing infrastructure.

• Maintains fragmented supply chain and proprietary process protection to safeguard intellectual property.

• Facilities in Goleta, CA, support R&D, rapid prototyping, and automated testing for substrates up to 12 inches.