Investor presentation
Logotype for Aeluma Inc

Aeluma (ALMU) Investor presentation summary

Event summary combining transcript, slides, and related documents.

Logotype for Aeluma Inc

Investor presentation summary

19 May, 2026

Vision and technology

  • Aims to build the world's highest performance semiconductor chips with scalable manufacturing, focusing on next-generation photonics and large-diameter wafer production.

  • Achieved a breakthrough with InGaAs on silicon, enabling best-in-class materials for SWIR applications across multiple industries.

  • Manufactures the world's first 300 mm InP-on-Si wafer, overcoming supply chain constraints and enabling 5-10X lower manufacturing costs.

Manufacturing and scalability

  • Utilizes capital-light, large-volume manufacturing with primarily outsourced production and proprietary in-house steps.

  • Large-diameter substrate manufacturing enables economies of scale, with 300 mm wafers providing 16X the area of traditional 3-inch wafers.

  • Facilities include 12,000 sq. ft. for R&D and manufacturing, with ISO 9001:2015 certification and 300 mm MOCVD capability.

  • Rapid prototyping and partnerships for medium- and large-volume manufacturing support transition to commercialization.

Products and markets

  • Product portfolio includes large-area InGaAs photodiodes, high-speed photodiodes, SWIR photodiode arrays, quantum dot lasers, and quantum photonics wafers.

  • Addresses markets in mobile, consumer electronics, AI infrastructure, datacom, defense, aerospace, industrial, robotics, automotive, and quantum sectors.

  • SWIR sensors offer benefits like eye safety, operation in sunlight, night vision, higher sensitivity, and lower power consumption.

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