DOOSAN TESNA (131970) Q1 2026 earnings summary

Executive summary

• Specializes in semiconductor post-processing, focusing on wafer and package testing, and die preparation, with a diversified product portfolio including SoC, CIS, MCU, and Smartcard ICs.

• No new business lines planned; main operations remain in semiconductor testing and engineering services.

• Completed merger with subsidiary Engion in February 2025 to enhance operational synergy.

Financial highlights

• Q1 2026 revenue: ₩76.8 billion, down from ₩303.9 billion in Q1 2025.

• Q1 2026 operating income: ₩5.5 billion; net income: ₩8.4 billion; basic EPS: ₩439.

• Total assets at Q1 2026: ₩681.4 billion; equity: ₩442.9 billion; liabilities: ₩238.5 billion.

• Cash and equivalents at Q1 2026: ₩98.7 billion.

• Gross margin for Q1 2026: 17.2%.

Outlook and guidance

• Ongoing large-scale facility investments (₩230.3 billion through 2027) to expand capacity and support growth.

• Dividend policy aims for stable shareholder returns, with recent cash dividends of ₩160 per share.