DOOSAN TESNA (131970) Q2 2026 earnings summary

Executive summary

• Specializes in semiconductor post-processing, focusing on wafer and package testing, with a growing Die Preparation (DP) segment.

• Major restructuring: DP business to be discontinued post-June 2026 to focus on core competencies and profitability.

• Completed merger with subsidiary Engion in February 2025 to enhance operational efficiency.

Financial highlights

• H1 2026 revenue: KRW 157.8 billion, down from KRW 303.9 billion in FY2025 and KRW 374.2 billion in FY2024.

• Operating income for H1 2026: KRW 15.3 billion, rebounding from a loss of KRW 0.9 billion in FY2025.

• Net income for H1 2026: KRW 15.5 billion, up from KRW 1.5 billion in FY2025 and KRW 36.8 billion in FY2024.

• Basic EPS for H1 2026: KRW 805, compared to KRW 78 in FY2025 and KRW 1,912 in FY2024.

• Cash and equivalents at June 2026: KRW 85.0 billion, down from KRW 109.5 billion at end-2025.

Outlook and guidance

• No new business lines planned; focus remains on semiconductor testing and engineering services.

• Ongoing large-scale facility investments (KRW 230.3 billion through 2027) to support mid- to long-term growth.

• Dividend policy aims for stable shareholder returns, with recent annual cash dividends of KRW 160 per share.