Investor presentation
Logotype for eMemory Technology Inc

eMemory Technology (3529) Investor presentation summary

Event summary combining transcript, slides, and related documents.

Logotype for eMemory Technology Inc

Investor presentation summary

16 Oct, 2026

Business model and scale

  • Logic-compatible eNVM IP enables embedded non-volatile memory in standard logic processes without extra costly steps; licensing to foundries and chip designers supports scalable integration.

  • Portfolio spans 772 production processes from 0.5μm to 2nm, with 79M+ cumulative wafers shipped and 5M 8-inch-equivalent wafers shipped in H1 2026.

  • Revenue comprises royalty and license/design revenue; the presentation describes wafer shipments as a source of recurring royalty revenue with long-term visibility.

  • More than 1,370 patents issued and 221 pending; team of 339 with 73% focused on R&D.

Memory and security portfolio

  • OTP products NeoBit and NeoFuse support memory repair, image-sensor recovery, analog trimming and key storage; MTP products NeoFlash, NeoMTP and NeoEE support firmware updates, data logging and configuration.

  • NeoPUF generates keys on demand from microscopic physical variations rather than storing them, positioning it as a hardware root of trust; security offerings extend to crypto processors, secure elements and HSMs.

  • NeoFuse is physically invisible and resistant to physical attacks; at 32K × 8 density, the cited OTP design uses one 0.33 mm² macro versus 16 e-fuse macros totaling ~1.92 mm², with no buffer SRAM required.

  • Logic-compatible MTP supports capacities from bits to megabits, with scalable storage, high endurance and standard-logic integration without mask overhead.

Commercial traction

  • More than 850 IPs registered at TSMC and over 2,600 new tape-outs across leading-edge and mature nodes; over 25M 8-inch-equivalent wafer shipments underpin recurring royalties.

  • Over 150 advanced-node tape-out licenses: 70 at 3nm–7nm and 88 at 12nm/16nm, across applications including CPUs, GPUs, SSD controllers, SoCs, Ethernet ICs and ASICs.

  • Recognized as TSMC’s Best IP Partner every year since 2010; founded in 2000 and IPO in 2011.

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