EnSilica (ENSI) Corporate presentation summary

Business profile and model

• Fabless designer and supplier of complex mixed-signal ASICs and ASSPs for space and satellite communications, automotive, and industrial markets; founded in 2001 and headquartered in Oxford.

• More than 210 staff, over 80% engineers, across the UK, Germany, Taiwan, Brazil, Hungary and India; listed on AIM and OTCQX.

• Customer-funded ASIC NRE can lead to long-life chip supply; internally funded ASSP platforms target multi-customer sales and reusable IP.

• Flexible engagements span design services, manufacturing services, turnkey ASICs and platform/ASSP supply, with greater IP reuse and recurring revenue toward platform products.

Financial momentum and portfolio

• FY26 unaudited revenue £27.5m, up c.51% YoY; EBITDA £4.7m; year-end cash at 31 May 2026 was £7.5m, up 275% YoY.

• FY27 management guidance: revenue £32m–£34m, up c.16%–24% vs FY26; EBITDA £5.5m–£6.5m.

• Lifetime supply visibility $375m and sales/opportunities pipeline $600m+, each up 50% vs FY25; rising chip supply revenue and contracted NRE expected to support near-term cash generation.

• 14 chips in design and 5 in supply; target 3–4 new design and supply contracts annually. The revenue evolution chart is illustrative, not a forecast.

Space and satellite communications

• SatCom market projected to grow from $98bn in 2025 to $223bn in 2033 at 11% CAGR; user-terminal silicon SAM projected to scale 5x by 2030.

• Four satellite-terminal chips sampling with customers; $50m user-terminal ASSP design win with a major European operator and $30m in lead-customer and Space Agency funding secured.

• AST SpaceMobile payload ASIC delivered; $3.8m payload ASIC win with a leading European satellite provider; two further payload engagements are at funded-study stage.

• Product focus includes user-terminal beamforming and 5G NTN modem chipsets, LEO/MEO payload beamforming, and resilient positioning, navigation and timing.