HANMI Semiconductor (042700) Q3 2026 earnings summary

Executive summary

• 9M 2026 revenue was KRW 483,079 million and operating income KRW 229,606 million; net income was KRW 162,400 million, below the prior-year 9M results.

• AI and HBM packaging demand underpin product development and factory investment, including dedicated hybrid-bonder capacity and expanded AI-packaging equipment offerings.

Financial highlights

• 9M revenue was KRW 483,079 million versus KRW 493,670 million in 9M 2025; operating income was KRW 229,606 million versus KRW 285,470 million.

• 9M net income was KRW 162,400 million versus KRW 185,149 million in 9M 2025; basic EPS was KRW 1,712 versus KRW 1,952.

• Total assets were KRW 905,969 million at Sept. 30, 2026, versus KRW 813,332 million at 2025 year-end; equity was KRW 781,619 million versus KRW 690,328 million.

• Cash and cash equivalents were KRW 140,066 million, down from KRW 276,235 million at 2025 year-end.

Outlook and guidance

• HBM4/4E TC-bonder supply is expected to expand; a Wide TC Bonder is in development for wider-die stacking, alongside hybrid bonders for HBM and AI system-chip packaging.

• Five AI system-chip packaging bonder models are in the lineup, with deliveries to Taiwan’s AI-packaging market expected from 2027.

• Factory 7, a KRW 57,824 million hybrid-bonder facility, had a planned investment period through Nov. 30, 2026; Factory 8, a KRW 56,000 million site, was scheduled for acquisition on Feb. 17, 2027.