Investor Day 2026
Logotype for Qualcomm Incorporated

Qualcomm (QCOM) Investor Day 2026 summary

Event summary combining transcript, slides, and related documents.

Logotype for Qualcomm Incorporated

Investor Day 2026 summary

25 Jun, 2026

Strategic transformation and future direction

  • Transitioning from a mobile-focused semiconductor company to a diversified edge and cloud computing leader, with three pillars: data center expansion, full-stack physical AI solutions, and integrated hardware-software platforms.

  • Building a comprehensive data center portfolio, including custom silicon, AI accelerators, CPUs, and advanced connectivity, targeting a $1 trillion TAM and aiming for over 5% market share in 5–7 years.

  • Acquired Modular to deliver an open, heterogeneous AI software stack, enabling seamless deployment across diverse hardware and bridging edge and data center AI.

  • Strategic partnerships with Microsoft, Meta, Google, and Hugging Face to accelerate adoption of new compute architectures and open AI models across devices and cloud.

  • Emphasis on developer-centric platforms, open ecosystems, and rapid product cycles to drive innovation and customer adoption.

Financial guidance and growth outlook

  • Fiscal 2029 non-handset revenue target raised from $22B to $40B, with a 40% CAGR from 2025–2029.

  • Data center revenue forecast: $5B in FY27, $15B in FY29, driven by custom silicon, AI accelerators, CPUs, and connectivity, with two hyperscaler customers each contributing over $1B in FY27.

  • Automotive revenue target increased to $10B in FY29, with a $65B design win pipeline and leadership in digital cockpit, ADAS, and connectivity.

  • IoT, industrial, and robotics expected to exceed $14B in FY29, with strong growth in personal AI, PCs, and industrial networking.

  • Handsets projected to be less than one-third of revenue by FY29; long-term opportunity to scale total revenue to $100B.

New business developments and technology innovation

  • Launching Dragonfly data center infrastructure, introducing HBC (high-bandwidth compute) to break memory bottlenecks and deliver 4–8x TCO advantage over competitors.

  • Multi-generational product roadmap: AI250 (2027) and AI300 (2028) for near-memory compute, integrating advanced network fabrics and optical connectivity.

  • C1000 server-class CPUs with >5GHz cores and >250 cores, targeting $200B market and multi-generational collaboration with Meta.

  • Expanding physical AI leadership in automotive, industrial, and robotics, with full-stack platforms, rapid product cycles, and developer-first tools.

  • Robotics business scaling rapidly with IQ10 SoC, reference designs, and over 100 engagements, aiming to lead the trillion-dollar embodied AI market.

Partial view of Summaries dataset, powered by Quartr API
AI can get things wrong. Verify important information.
All investor relations material. One API.
Learn more