Taiwan Semiconductor Manufacturing Company (TSM) Q4 2025 earnings summary
Event summary combining transcript, slides, and related documents.
Q4 2025 earnings summary
22 Jul, 2026Executive summary
Fourth quarter 2025 revenue reached NT$1,046.09 billion, up 1.9% sequentially and 25.5% year-over-year, with net income at NT$505.74 billion, up 11.8% sequentially and 35.0% year-over-year.
EPS for Q4 2025 was NT$19.50, up 11.8% sequentially and 35.0% year-over-year; full-year EPS was NT$66.25, up 46.4% from 2024.
Full-year 2025 revenue grew 31.6% year-over-year to NT$3,809.05 billion (US$122.42 billion), with advanced technologies (7nm and below) accounting for 74%-77% of wafer revenue.
AI-related demand and robust growth in HPC, smartphone, IoT, and automotive platforms fueled performance.
Consolidated financials audited in accordance with IFRS; company operates as a global foundry with significant international operations.
Financial highlights
Q4 2025 gross margin was 62.3%, up 2.8 percentage points sequentially; operating margin was 54.0%, up 3.4 points sequentially.
Full-year 2025 gross margin improved to 59.9%, operating margin to 50.8%, and net profit margin to 45.1% (up 4.6 points from 2024).
Free cash flow for 2025 was NT$1,002.57 billion, up 15.2% year-over-year; cash dividends paid increased 28.6% to NT$466.78 billion.
ROE for 2025 was 35.4%, up 5.1 points year-over-year.
Total assets at year-end 2025 were NT$7,933,024 million, up from NT$6,691,938 million in 2024.
Outlook and guidance
Q1 2026 revenue expected between $34.6B and $35.8B, up 4% sequentially and 38% year-over-year; gross margin guided at 63%-65%, operating margin at 54%-56%.
Full-year 2026 revenue forecasted to grow close to 30% in USD terms; Foundry 2.0 industry expected to grow 14%.
Effective tax rate expected to rise to 17%-18% in 2026.
Ongoing investments in capacity expansion and technology leadership, supported by strong cash flows and government grants.
Management expects ongoing demand in high-performance computing and automotive segments.
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