Tongfu Microelectronics (002156) Q2 2026 earnings summary

Executive summary

• Achieved revenue of ¥16.04 billion in H1 2026, up 23.03% year-over-year; net profit attributable to shareholders surged 316.77% to ¥1.72 billion.

• Advanced packaging and testing business drove growth, with high-end product mix and overseas markets contributing significantly.

• Major customer AMD's business hit record highs, supporting overall performance.

Financial highlights

• Operating income: ¥16.04 billion, up 23.03% year-over-year.

• Net profit attributable to shareholders: ¥1.72 billion, up 316.77% year-over-year.

• Gross margin for IC packaging/testing: 15.12%, up 0.73 percentage points.

• Operating cash flow: ¥2.93 billion, up 18.25% year-over-year.

• Basic/diluted EPS: ¥1.1317, up 316.83% year-over-year.

Outlook and guidance

• AI demand expected to remain the core driver for semiconductor industry growth in H2 2026.

• Advanced packaging market to expand further, with structural differentiation across segments.

• Company to focus on capacity expansion, advanced process implementation, and global collaboration.