Zuken (6947) Corporate presentation summary

Progress of the medium-term business plan

• Achieved record-high sales and operating profit in the first year, with a record order backlog entering the second year.

• Joined the TSMC OIP EDA Alliance and formed a strategic partnership with Valeo to develop an AI-driven electronic design platform.

• AI proliferation is driving demand for high-spec PCB design, advanced packaging, and integrated chip/package/PCB solutions.

• Strategic focus on 3DIC and system/package design markets, with global expansion of consulting-driven IT and MBSE-based process reforms.

Performance details and outlook

• Sales are forecast to grow from ¥40.7B (FY3/25) to ¥50B (FY3/28), with operating profit rising from ¥5.4B to ¥7.4B and OPM improving to 15.1%.

• Order backlog remains high due to robust global IT investment.

• Sales growth is supported by strong demand in Japan (IT infrastructure, automotive) and overseas (industrial machinery, energy, aerospace/defense).

• Product-wise, design automation and data management segments are expanding, with strong demand for smart factory and DX solutions.

Growth sectors and strategic initiatives

• Consulting-driven IT business, especially MBSE, is expanding globally, though domestic automotive-related projects declined.

• Enhanced presence as a global MBSE vendor, with key initiatives at international events and targeted expansion in Europe and Asia.

• AI and 3DIC trends are accelerating integrated design needs and driving new business opportunities.