Applied Materials (AMAT) investor relations material

AI-driven demand and market position

• AI demand is accelerating leading-edge foundry logic, DRAM and advanced packaging; these segments represented ~80% of incremental WFE growth in 2026 and are expected to account for ~75% through 2030.

• Agentic AI pods consume 2x–4x more wafers than generative AI pods; 85% of agentic AI factory wafer-start content is leading-edge logic, DRAM and advanced packaging.

• Data center demand has overtaken mobile as the leading driver of leading-edge logic wafer starts; high-performance computing is also driving DRAM demand.

• The business expects to outgrow WFE and gain over 2 percentage points of WFE share by 2030, with leadership in foundry logic, DRAM and advanced packaging.

• Capacity constraints include clean-room space, supply-chain components, energy and financing; clean-room availability is the primary near-term growth variable, with demand growth expected to be uneven.

Technology portfolio and EPIC

• EPIC launched as a collaborative R&D center, bringing customers and partners together to co-create future architectures across technology nodes N+1 through N+4; teams use over 100 test vehicles and customer reticles.

• EPIC's parallel development model is intended to compress a 10–15-year path from university materials research to commercial chips by 2x.

• Over 60% of chip materials are created using the portfolio's equipment; 13 products launched in the prior 12 months for transistors, wiring and advanced packaging.

• Copper wiring products are expected to deliver $3B revenue in 2026; integrated solutions grew to 20%–30% of system revenue.

• Advanced packaging is expected to exceed $5B within a few years; HBM packaging revenue is expected to exceed $1B in 2026, and hybrid bonding could double the addressable market versus micro bumps and TSV.

Process control and inspection

• Optical inspection revenue is expected to grow 50% from 2025 to 2026; new products planned over the next few years target $7B of additional market opportunity.

• EBeam revenue is expected to grow 50% from 2025 to 2026, driven mainly by yield needs; strong share gains are expected over the next five years.

• Combined systems and service revenue is expected to reach $3B in 2026, with very high growth thereafter.

• Electron metrology enables full-wafer maps with thousands of measurement points, supporting faster process tuning and yield improvement than destructive TEM sampling.

• A new in-line transistor measurement market is estimated at several hundred million dollars; the capability can identify sub-angstrom film thickness and composition before electrical test.