Camtek (CAMT) investor relations material

Financial outlook and targets

• Q3 2026 revenue preannounced at $160m–$161m, up 27% YoY; Q4 guidance ~$180m, up 40% YoY, bringing FY2026 revenue to ~$595m.

• 2027 revenue outlook exceeds $800m, representing growth of more than 35% YoY; visibility extends about a year ahead.

• Organic revenue target of ~$1.2bn in ~3 years, implying CAGR above 26% from 2026; replaces the prior $750m model, a 60% increase.

• At $1.2bn revenue, non-GAAP gross margin target is 55%–56% and operating margin 34%–36%, versus current targets of 51%–52% and 27%–28%.

Growth strategy and markets

• Advanced packaging is the core growth market, led by HBM, 2.5D/3D integration and photonics for AI data centers and emerging edge and physical AI applications.

• 2025–2031 wafer-processing CAGR is forecast at 13% for advanced packaging versus 7% for total production wafers; high-end advanced packaging is forecast at 24% and represents 60%–70% of sales.

• More than $800m of orders received in 2026; ~80% were for advanced packaging, mostly high-end AI applications, and OSATs accounted for more than 50%.

• SAM is projected to reach ~$6bn by 2030, from estimates of ~$1.5bn in advanced-packaging inspection, ~$500m in macro inspection and $200m in metrology.

• Silicon photonics dies are forecast to grow 24× by 2030; photonics represented ~5% of orders on hand, with a larger business ramp expected from 2028. Hybrid bonding adoption is progressing more slowly.

Technology and product roadmap

• Hawk targets high-end packaging, HBM and hybrid bonding; Eagle G5 and NanoProf address inspection and metrology across packaging and wafer fabrication.

• A 10th-generation bump-height sensor is planned for 2027 to measure bumps below 5μm; the current 9th-generation sensor addresses bumps down to 6μm.

• Roadmap includes sub-150nm defect sensitivity, hybrid-bond void detection, TSV depth, post-CMP topology and copper-pad dishing metrology, and faster die-warpage measurement.

• AI is being applied to inspection, classification, setup and metrology; Visual Layer accelerated tool algorithms and supports AI software products planned for 2027.