Camtek (CAMT) Investor presentation summary

Business overview and market position

• Specializes in inspection and metrology systems for the semiconductor market, with over 3,000 tools installed and more than 300 customers, including major industry players.

• Focuses on advanced packaging, supporting high-performance computing (HPC), HBM, chiplets, and other cutting-edge applications.

• 70% of business comes from Tier 1 customers, with a strong presence in the rapidly growing HPC market.

• Main market segments include heterogenous integration, BEOL front-end, compound semiconductors, power, RF, and CMOS image sensors.

• Positioned as a market leader, competing with KLA and Applied Materials in inspection and metrology.

Product innovation and technology

• Offers Eagle and Hawk platforms for inspection and 3D metrology, capable of sub-micron defect detection and high-volume bump inspection.

• Launched Eagle G5 in September 2024 and Hawk in February 2025, with significant improvements in speed, sensitivity, and defect detection.

• New products target advanced packaging, chiplets, HBM, and hybrid bonding, enabling inspection of 500M bumps at small pitch.

• Technology supports 100% die inspection, ensuring known-good-die for critical applications.

• FRT acquisition has contributed to expanded metrology capabilities.

Market trends and growth drivers

• Double-digit growth expected in target markets, with HPC and AI driving 25-35% growth through 2030 and representing 45% of revenues.

• CoWoS and similar advanced packaging technologies are key for HPC and AI, with projected 51% CAGR for related packages from 2025-2029.

• AI adoption is fueling exponential demand for HPC hardware, with future opportunities in edge devices.

• Increasing inspection and metrology steps required as chiplet and HBM manufacturing grows.

• Market expansion driven by new technologies, increased wafer density, and software/services revenue.