Amtech Systems (ASYS) Investor Presentation summary

Business transformation and market focus

• Transitioning to enable AI semiconductor device packaging and advanced substrate fabrication for profitable growth.

• Supplying capital equipment and consumables for semiconductor fabrication, with focus on thermal processing and advanced packaging for AI, automotive, and industrial electronics.

• Leveraging CMP Foundry Service to accelerate chemical consumables business and support advanced materials development.

Operational improvements and financial discipline

• Achieved combined annualized savings of $13M, reducing breakeven from $120M to $75M.

• Upgraded supply chain, implemented value-based pricing, eliminated debt, and increased cash balance.

• Rationalized product lines, migrated to a semi-fabless model, and right-sized the organization.

Revenue growth and segment performance

• AI-related revenue in Thermal Processing Solutions segment grew 5X year-over-year, now 25% of segment revenue.

• Achieved 60% sequential growth in AI-related revenue, driven by advanced chip packaging and assembly solutions.

• Advanced packaging technologies include flip chip, 2.5D, CoWoS, and panel packaging.