Camtek (CAMT) Investor Presentation summary

Business overview and market position

• Specializes in inspection and metrology systems for the semiconductor market, with over 3,000 tools installed and more than 300 customers, 70% of which are Tier 1 accounts.

• Market leader in advanced packaging, serving major semiconductor manufacturers and OSATs.

• Main market segments include heterogeneous integration, BEOL front-end, compound semiconductors, power, RF, and CMOS image sensors.

• Systems ensure 100% die inspection on wafers, supporting known-good-die requirements.

Product innovation and technology

• Offers Eagle and Hawk platforms for sub-micron frontside, backside, and edge inspection, as well as advanced 3D metrology.

• Released Eagle G5 in September 2024 and Hawk in February 2025, with Hawk doubling throughput and enhancing defect detection to 150nm.

• Technology supports inspection and metrology for up to 500 million bumps per wafer, targeting advanced packaging like chiplets, HBM, and hybrid bonding.

• FRT acquisition contributed to expanded metrology capabilities.

Market trends and growth drivers

• Double-digit growth expected in target markets, especially HPC, AI, HBM, chiplets, automotive, and SiC through 2030.

• Majority of business supports HPC-related hardware, with AI adoption driving exponential demand in server farms and edge computing.

• CoWoS and similar advanced packaging technologies are key for HPC and AI, with most wafers in this segment inspected using their tools.

• Projected 51% CAGR for CoWoS and similar packages from 2025-2029.